Motherboard SUPERMICRO X12STL-F Intel Xeon E-2300 C252 LGA-1200 (Socket H5) micro ATX (MBD-X12STL-F-O) Box

PLN 1,682.71
Shipping from warehouse: ⁨A3⁩
Estimated shipping: Thu, Jun 13 - Mon, Jun 17
14 days returnUnconditional return policy
Availability:
large quantity
Brand:
Supermicro
Product code:
MBD-X12STL-F-O / 0672042461608

Specification

Acpi version:6.0
Bios memory size:256 Mbit
Bios type:UEFI
Com ports quantity:1
Component for:Server
Depth:244 mm
Disk on module (dom) power connector:Y
Ecc:Yes
Ethernet interface type:Fast Ethernet, Gigabit Ethernet
Ethernet lan:Yes
Ethernet lan (rj-45) ports:2
Intel xeon series:E-2300
Ipmi lan (rj-45) port:Yes
Lithography:14 nm
M.2 card slot (storage):2280/22110 (M-key)
Maximum internal memory:128 GB
Maximum udimm memory:128 GB
Memory voltage:1.2 V
Motherboard chipset:Intel C252
Motherboard form factor:micro ATX
Number of dimm slots:4
Number of processors supported:1
Number of sata iii connectors:6
On-board graphics card model:Aspeed AST2400
Operating temperature (t-t):0 - 50 °C
Package type:Box
Pci express x2 (gen 3.x) slots:1
Pci express x4 (gen 4.x) slots:1
Pci express x8 (gen 4.x) slots:2
Processor manufacturer:Intel
Processor number of cores supported:8
Processor socket:LGA 1200 (Socket H5)
Processor thermal power (max):95 W
Raid levels:10, 1, 0, 5
Raid support:Yes
Real time clock (rtc):Y
Recommended humidity operating range:10 - 85%
Storage relative humidity (h-h):10 - 95%
Storage temperature (t-t):-20 - 60 °C
Supported dimm module capacities:8GB, 32GB, 4GB, 16GB
Supported memory clock speeds:3200, 2666, 2933
Supported memory types:DDR4-SDRAM
Supported storage drive interfaces:SATA III
Sustainability certificates:RoHS
System management bios (smbios) version:3.3
Tpm connector:Yes
Trusted platform module (tpm):Yes
Trusted platform module (tpm) version:2.0
Uefi version:2.7
Usb 2.0 connectors:2
Usb 2.0 ports quantity:2
Usb 3.2 gen 1 (3.1 gen 1) connectors:2
Usb 3.2 gen 1 (3.1 gen 1) type-a ports quantity:1
Vga (d-sub) ports quantity:1
Wi-fi:No
Width:244 mm

Despite our best efforts, we cannot guarantee that the published technical data and photos do not contain inaccuracies or errors, which, however, cannot be a basis for claims.

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