Pasta termiczna przeznaczona do scalania z radiatorami- Ułatwia odprowadzanie ciepła z procesora, chipsetu i procesora do radiatora- Doskonały impedancja termiczna- Zapewnia stabilność, doskonale scala, nie rozwarstwia się, nie utlenia.- Nie przewodzi prądu elektrycznego
Gembird TG-G3.0-01 heat sink compound 4.5 W/m·K 3 g
PLN 38.37
Shipping from warehouse: E12
Estimated shipping: Mon, Oct 27 - Wed, Oct 29
14 days returnUnconditional return policy
- Availability:
- large quantity
- Brand:
- Product code:
- TG-G3.0-01 / 8716309083133
Share this product:
Specification
| Depth: | 180 mm |
|---|---|
| Height: | 15 mm |
| Operating temperature (t-t): | -50 - 240 °C |
| Package depth: | 390 mm |
| Package height: | 280 mm |
| Package weight: | 3.6 kg |
| Package width: | 380 mm |
| Product colour: | Grey |
| Sustainability certificates: | RoHS |
| Thermal conductivity: | 4.5 W/m·K |
| Thermal resistance: | 0.205 °C/W |
| Viscosity note: | 76 CPS |
| Weight: | 3 g |
| Width: | 120 mm |
Despite our best efforts, we cannot guarantee that the published technical data and photos do not contain inaccuracies or errors, which, however, cannot be a basis for claims.